
DESCRIPTION
2-PART ENCAPSULATION AND POTTING SILICONE
FEATURE
• 100% SOLIDS - NO SOLVENTS
• LONG POT LIFE
• LOW MODULUS AND GOOD ELONGATION
• UL94 V0 LISTED IN FILE NO. E205830
CODE
QSil 553
Feature
FEATURE 1
100% solids - no solvents
FEATURE 2
Long pot life
FEATURE 3
Low modulus and good elongation
FEATURE 4
UL94 V0 listed in file No. E205830
COLOR
Grey
COMPARATIVE TRACKING INDEX (VOLTS)
600 volts
CURE PROFILE
15 mins at 150°C
CURE TYPE
Addition
DE-MOULD TIME / FULL CURE AT 23°C/73°F
24 hr hrs
DENSITY A
1.63
DENSITY B
1.63
DIELECTRIC CONSTANT
3.08
DIELECTRIC STRENGTH (V/MIL)
500 V/mil
DISSIPATION FACTOR
0.009
ELONGATION AT BREAK
240 %
HARDNESS SHORE A
45
MAX STORAGE TEMPERATURE
38 °C