DESCRIPTION

2-PART ENCAPSULATION AND POTTING SILICONE

FEATURE

•           100% SOLIDS - NO SOLVENTS

•           LONG POT LIFE

•           LOW MODULUS AND GOOD ELONGATION

•           UL94 V0 LISTED IN FILE NO. E205830

CODE

QSil 553

 Feature

FEATURE 1

100% solids - no solvents

FEATURE 2

Long pot life

FEATURE 3

Low modulus and good elongation

FEATURE 4

UL94 V0 listed in file No. E205830

COLOR

Grey

COMPARATIVE TRACKING INDEX (VOLTS)

600 volts

CURE PROFILE

15 mins at 150°C

CURE TYPE

Addition

DE-MOULD TIME / FULL CURE AT 23°C/73°F

24 hr hrs

DENSITY A

1.63

DENSITY B

1.63

DIELECTRIC CONSTANT

3.08

DIELECTRIC STRENGTH (V/MIL)

500 V/mil

DISSIPATION FACTOR

0.009

ELONGATION AT BREAK

240 %

HARDNESS SHORE A

45

MAX STORAGE TEMPERATURE

38 °C