DESCRIPTION          

A 2 Mil polyimide film backing with a silicone pressure sensitive adhesive system.

PROPERTY                           

Adhesive TypeSilicone

Total Thickness        (mm)0.085

Film Thickness        (mm)0.050                            

Elongation at break%  ≥ 53

Peel Strength        (N/25mm)≥ 6.5

Tensile Strength        (N/25mm)185              

Breakdown voltage(KV)≥8.0        

Insulation Grade        (@ 200°c)H  

Insulation Resistance(Ω @ 200°c)1 x 106

Maximum Temperature(°C)250

Temp. Resistant Testing(200°C)One hour no adhesive remained   

Dielectric Constant(@ 50 Hz)3.1 ~ 3.9

Dielectric Strength        (@ 50 Hz)150 v/mm

 Dissipation Factor        (@ 50 Hz)0.04

Volume Resistivity        (Ohm.m)1 x 1010

UL Flammability Ratingv-0