
DESCRIPTION
A 2 Mil polyimide film backing with a silicone pressure sensitive adhesive system.
PROPERTY
Adhesive TypeSilicone
Total Thickness (mm)0.085
Film Thickness (mm)0.050
Elongation at break% ≥ 53
Peel Strength (N/25mm)≥ 6.5
Tensile Strength (N/25mm)185
Breakdown voltage(KV)≥8.0
Insulation Grade (@ 200°c)H
Insulation Resistance(Ω @ 200°c)1 x 106
Maximum Temperature(°C)250
Temp. Resistant Testing(200°C)One hour no adhesive remained
Dielectric Constant(@ 50 Hz)3.1 ~ 3.9
Dielectric Strength (@ 50 Hz)150 v/mm
Dissipation Factor (@ 50 Hz)0.04
Volume Resistivity (Ohm.m)1 x 1010
UL Flammability Ratingv-0